As the scale and energy consumption of AI-driven data centers are rising rapidly, the Open Compute Project (OCP) revealed a number of key collaborations and organizational adjustments at the 2025 Global Summit. From Broadcom returning to the network...
As the scale and energy consumption of AI-driven data centers are rising rapidly, the Open Compute Project (OCP) revealed a number of key collaborations and organizational adjustments at the 2025 Global Summit. From Broadcom returning to the network standardization working group to AMD, ARM, and NVIDIA joining the board of directors, OCP is evolving from the "Open Hardware Alliance" to the core platform of "AI and sustainable infrastructure ecology."
This OCP summit focuses on open collaboration and standardization, aiming to promote a more unified and efficient global data center architecture, so that the industry can respond to the computing and energy challenges in the AI era in an open ecological manner.
Broadcom returns, three major alliances promote openness and sustainabilityOn the technical level, OCP announced the establishment of a new network standardization working group, co-led by Broadcom and Arista, to coordinate global industry players to promote unified standards for the link layer (Link Layer) and transport layer (Transport Layer).
At the same time, OCP also expanded industrial cooperation and announced alliances with three major international organizations:
Storage Networking Industry Association (SNIA): Unified AI cluster storage architecture; ASHRAE (American HVAC Association): jointly develop data center cooling and sustainable energy efficiency standards; OIX (Open IX): Enhanced OCP Ready facilities and open network certification.In terms of sustainability, OCP officially launched the data center carbon emissions and equipment carbon footprint reporting framework after one year of cooperation with Infrastructure Masons (iMasons). This standard was jointly developed by Google, Meta, Microsoft, Schneider Electric and other large-scale cloud companies. In the future, it will be introduced into the OCP market ecosystem and cooperate with the unified labeling system to promote global carbon disclosure and transparency.
The number of global members exceeds 500, and OCP lays out a full-link ecosystem from silicon crystal to power gridCurrently, OCP has more than 500 global members. OCP Ready facilities and experience centers continue to expand and have been included in actual deployments by many hyperscalers. According to IDC research, the market size of OCP certified equipment is expected to reach US$295 billion in 2029. OCP believes that the actual number may be higher, reflecting the explosive demand for AI computing infrastructure.
OCP simultaneously announced that AMD, ARM, and NVIDIA have joined the board of directors to further connect the complete open ecosystem from silicon chips, system architecture to data centers.
In the future, OCP will use the "Open Data Center Strategic Initiative" as its core strategy to build an open data center architecture covering silicon → system → physical facilities → power grid, extending from the cloud to AI and edge computing (Edge), and promote a new generation of global data center standards.
As AI demands and energy challenges go hand in hand, the development direction of OCP shows that open standards are gradually becoming a key bridge connecting chip design, data centers and power infrastructure. OCP is also moving towards an "open infrastructure platform in the AI era", driving a new era of global collaboration from the cloud to the power grid.
